Michael Töpper
5Patents
1h-index
15Co-inventors
44Inventor score
Filing activity: Dec 1, 2006 → Jul 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7388288B2 | Flip chip metallization method and devices | Electricity | 14 | Active |
| US8521303B2 | In vivo implantable coil assembly | Human Necessities | 1 | Active |
| US12358826B2 | Method of joining glass elements with material continuity, glass component, and housing, and vacuum insulating glass panel comprising the glass component | Chemistry; Metallurgy | 0 | Active |
| US10403576B2 | Method for manufacturing an electronic component and an electronic component | Electricity | 0 | Active |
| US10134707B2 | Bonding method for connecting two wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.