Patent · US Active

Selecting a substrate to be soldered to a carrier

US10141199B2 · kind B2 · utility

0Cited by

3References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Charles Rimbert-Riviere · Soest, DE
Jean-Laurent Deborde · Dortmund, DE
Martin Haller · Mountain View, US
Nils Alexander Sanetra · Soest, DE
Vasile Vartolomei · Ottobeuren, DE

Key dates

Filing date	Aug 30, 2016
Grant date	Nov 27, 2018
Priority date	—
Expiry date	May 23, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for soldering an insulating substrate onto a substrate mounting portion of a carrier by a predefined solder is provided. The insulating substrate includes a dielectric insulation carrier, a top side, and a bottom side opposite to the top side. The method includes selecting the insulating substrate based on a criterion which indicates that the insulating substrate, if it has the solidus temperature of the solder, has a positive unevenness. The insulating substrate is soldered on the bottom side to the substrate mounting portion, such that, after the soldering, the solidified solder extends continuously from the bottom side of the insulating substrate as far as the substrate mounting portion. The top side of the insulating substrate is populated with at least one semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.