Patent · US Active

Apparatus and method for cleaning semiconductor wafer

US10141205B2 · kind B2 · utility

1Cited by

2References

10Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Xi Wang · Shanghai, CN
Cheng-Liang Cheng · Hsinchu, TW
Jun Wu · Shanghai, CN
Hui Wang · Shanghai, CN

Key dates

Filing date	Sep 26, 2014
Grant date	Nov 27, 2018
Priority date	—
Expiry date	Sep 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68764
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

An apparatus and method for cleaning semiconductor wafer are provided. The apparatus includes a brush module, a swing arm, a rotating actuator and an elevating actuator. The brush module has a brush head for providing mechanical force on a surface of a wafer. An end of the swing arm mounts the brush module. The rotating actuator is connected with the other end of the swing arm. The rotating actuator drives the swing arm to swing across the whole surface of the wafer, which brings the brush head moving across the whole surface of the wafer. The elevating actuator is connected with the other end of the swing arm. The elevating actuator drives the swing arm to rise or descend, which brings the brush module rising or descending. The apparatus cleans the semi-conductor wafer by means of the brush head, which improves the cleaning effect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.