RF amplifier package with biasing strip
US10141303B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Sep 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF semiconductor amplifier package includes a flange shaped body section, an electrically conductive die pad centrally located on the body section, and an electrically insulating window frame disposed on an upper surface of the body section. A first electrically conductive lead is disposed on the window frame adjacent to a first side of the die pad and extends away from the first side of the die pad towards a first edge side of the body section. A second electrically conductive lead is disposed on the window frame adjacent to a second side of the die pad and extends away from the second side of the die pad towards a second edge side of the body section. A first electrically conductive biasing strip is disposed on the window frame, continuously connected to the second lead, and extends along and a third side of the die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.