Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
US10141623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Nov 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09618
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.