Jose A. Hejase
20Patents
2h-index
20Co-inventors
49Inventor score
Filing activity: Mar 28, 2014 → Oct 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10135162B1 | Method for fabricating a hybrid land grid array connector | Emerging Cross-Sectional Technologies | 5 | Active |
| US10128593B1 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Emerging Cross-Sectional Technologies | 4 | Active |
| US9368852B2 | Method for performing frequency band splitting | Electricity | 1 | Active |
| US9638750B2 | Frequency-domain high-speed bus signal integrity compliance model | Physics | 1 | Active |
| US10141623B2 | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board | Electricity | 1 | Active |
| US11658378B2 | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) | Electricity | 1 | Active |
| US10181628B2 | Reduction of crosstalk between dielectric waveguides using split ring resonators | Electricity | 1 | Active |
| US9686053B2 | Frequency-domain high-speed bus signal integrity compliance model | Electricity | 0 | Active |
| US10620253B2 | Noise modulation for on-chip noise measurement | Physics | 0 | Active |
| US10879575B2 | Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures | Electricity | 0 | Active |
| US11399428B2 | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication | Electricity | 0 | Active |
| US9835665B2 | Noise modulation for on-chip noise measurement | Physics | 0 | Active |
| US10199706B2 | Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes | Electricity | 0 | Active |
| US10167878B2 | Cooling fan coupled with a set of recirculation flaps | Emerging Cross-Sectional Technologies | 0 | Active |
| US12266598B2 | Dense via pitch interconnect to increase wiring density | Electricity | 0 | Active |
| US9797938B2 | Noise modulation for on-chip noise measurement | Physics | 0 | Active |
| US9733305B2 | Frequency-domain high-speed bus signal integrity compliance model | Physics | 0 | Active |
| US9893400B2 | Method for performing frequency band splitting | Electricity | 0 | Active |
| US9673941B2 | Frequency-domain high-speed bus signal integrity compliance model | Electricity | 0 | Active |
| US10167879B2 | Cooling fan coupled with a set of recirculation flaps | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.