Method for forming biochips and biochips with non-organic landings for improved thermal budget
US10145847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2014 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Feb 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.