Ching-Ray Chen
15Patents
5h-index
18Co-inventors
59Inventor score
Filing activity: Oct 15, 2010 → Nov 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8728844B1 | Backside CMOS compatible bioFET with no plasma induced damage | Electricity | 118 | Active |
| US9080969B2 | Backside CMOS compatible BioFET with no plasma induced damage | Electricity | 33 | Active |
| US8791557B2 | Microelectromechanical device with integrated package | Emerging Cross-Sectional Technologies | 12 | Active |
| US8846416B1 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Electricity | 8 | Active |
| US8405169B2 | Handling layer for transparent substrate | Performing Operations; Transporting | 8 | Active |
| US9968927B2 | Optical biosensor device | Physics | 2 | Active |
| US8883021B2 | MEMS nanostructures and methods of forming the same | Physics | 2 | Active |
| US9709525B2 | Backside CMOS compatible BioFET with no plasma induced damage | Electricity | 2 | Active |
| US10145847B2 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Electricity | 1 | Active |
| US10867836B2 | Wafer stack and fabrication method thereof | Electricity | 0 | Active |
| US10473616B2 | Backside CMOS compatible BioFET with no plasma induced damage | Electricity | 0 | Active |
| US9034678B2 | BioMEMS and planar light circuit with integrated package | Emerging Cross-Sectional Technologies | 0 | Active |
| US11280786B2 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Electricity | 0 | Active |
| US11099152B2 | Backside CMOS compatible BioFET with no plasma induced damage | Electricity | 0 | Active |
| US9493347B2 | Method of forming a semiconductor device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.