Dynamic mounting thermal management for devices on board
US10147664B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2017 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.