Overmold proximity sensor and associated methods
US10147834B2 · kind B2 · utility
8Cited by
0References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2015 |
| Grant date | Dec 4, 2018 |
| Priority date | — |
| Expiry date | Oct 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.