Patent assignee · SG · COMPANY

STMICROELECTRONICS PTE LTD

233Patents
233Active
233Granted
61Portfolio score

Filing activity: Oct 15, 2007 → Feb 21, 2024 · 13 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US8664044B2 Method of fabricating land grid array semiconductor package Emerging Cross-Sectional Technologies 275 Active
US8884422B2 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture Electricity 37 Active
US9529433B2 Flexible smart glove Physics 35 Active
US8436255B2 Fan-out wafer level package with polymeric layer for high reliability Emerging Cross-Sectional Technologies 35 Active
US8779601B2 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Electricity 26 Active
US8916481B2 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture Electricity 26 Active
US8436426B2 Multi-layer via-less thin film resistor Electricity 21 Active
US8497587B2 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same Electricity 17 Active
US8400257B2 Via-less thin film resistor with a dielectric cap Emerging Cross-Sectional Technologies 16 Active
US9911890B2 Optical sensor package including a cavity formed in an image sensor die Emerging Cross-Sectional Technologies 13 Active
US10429330B2 Gas analyzer that detects gases, humidity, and temperature Physics 13 Active
US8860152B2 Integrated chemical sensor Emerging Cross-Sectional Technologies 12 Active
US10254261B2 Integrated air quality sensor that detects multiple gas species Physics 11 Active
US8890269B2 Optical sensor package with through vias Electricity 11 Active
US8526214B2 Resistor thin film MTP memory Physics 10 Active
US9525002B2 Image sensor device with sensing surface cavity and related methods Electricity 9 Active
US8576574B2 Electromagnetic interference shielding on semiconductor devices Electricity 8 Active
US9698105B2 Electronic device with redistribution layer and stiffeners and related methods Electricity 8 Active
US10147834B2 Overmold proximity sensor and associated methods Electricity 8 Active
US8466997B2 Fan-out wafer level package for an optical sensor and method of manufacture thereof Electricity 8 Active
US9027400B2 Tunable humidity sensor with integrated heater Physics 8 Active
US9176089B2 Integrated multi-sensor module Electricity 8 Active
US9252030B1 System-in-packages and methods for forming same Electricity 7 Active
US9430328B2 Error correction in memory devices by multiple readings with different references Physics 7 Active
US9449912B1 Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming Electricity 7 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.