Method for embedding a discrete electrical device in a printed circuit board

US10149388B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Bruce J. Chamberlin · Vestal, US
• Andreas Huber · Holzgerlingen, DE
• Harald Huels · Eppelheim, DE
• Thomas Strach · Wildberg, DE
• Thomas-Michael Winkel · Eppelheim, DE

Key dates

• Filing date: Jun 7, 2016
• Grant date: Dec 4, 2018
• Expiry date: Dec 22, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10174
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.