Polyimide-based polymer thick film resistor composition
US10153075B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Dec 15, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.