Seigi Suh
20Patents
5h-index
19Co-inventors
66Inventor score
Filing activity: Sep 28, 2001 → Apr 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6969539B2 | Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide | Electricity | 54 | Expired |
| US7560581B2 | Vapor deposition of tungsten nitride | Electricity | 15 | Expired |
| US7507848B2 | Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide | Electricity | 9 | Active |
| US7067346B2 | Titanium carboxylate films for use in semiconductor processing | Electricity | 8 | Expired |
| US7795663B2 | Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof | Electricity | 5 | Expired |
| US7601181B2 | Methods of making thin film capacitors comprising a manganese doped barium titantate dielectric | Emerging Cross-Sectional Technologies | 3 | Active |
| US10910340B1 | Silver sintering preparation and the use thereof for the connecting of electronic components | Electricity | 2 | Active |
| US8334016B2 | Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide | Electricity | 1 | Active |
| US7572518B2 | Articles comprising manganese doped barium titanate thin film compositions | Emerging Cross-Sectional Technologies | 1 | Active |
| US10189950B2 | Polyimide-based polymer thick film compositions | Electricity | 1 | Active |
| US9905414B2 | Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide | Electricity | 1 | Active |
| US10508217B2 | Polyimide-based polymer thick film resistor composition | Electricity | 0 | Active |
| US10153075B2 | Polyimide-based polymer thick film resistor composition | Chemistry; Metallurgy | 0 | Active |
| US11938543B2 | Silver sintering preparation and the use thereof for the connecting of electronic components | Electricity | 0 | Active |
| US8875363B2 | Thin film capacitors on metal foils and methods of manufacturing same | Emerging Cross-Sectional Technologies | 0 | Active |
| US9637648B2 | Photonic sintering of a solderable polymer thick film copper conductor composition | Chemistry; Metallurgy | 0 | Active |
| US11289238B2 | Compositions for the filling of high aspect ratio vertical interconnect access (VIA) holes | Chemistry; Metallurgy | 0 | Active |
| US9649730B2 | Paste and process for forming a solderable polyimide-based polymer thick film conductor | Electricity | 0 | Active |
| US8183108B2 | Glass flux assisted sintering of chemical solution deposited thin dielectric films | Electricity | 0 | Active |
| US9637647B2 | Photonic sintering of a polymer thick film copper conductor composition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.