Substrate treating apparatus and substrate treating method
US10153181B2 · kind B2 · utility
8Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2017 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | May 23, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate treating apparatus including the following units: a supplying unit which supplies a process liquid including a sublimable substance in a melt state on a pattern-formed surface of a substrate W; a solidifying unit which solidifies the process liquid on the pattern-formed surface to produce a solidified body; and a sublimating unit which sublimates the solidified body to remove the solidified body from the pattern-formed surface. In this apparatus, the sublimable substance includes a fluorinated carbon compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.