Patent · US Active

Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus

US10153253B2 · kind B2 · utility

1Cited by

0References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Howe Yin Loo · Bayan Lepas, MY
Eng Huat Goh · Air Itam, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Khang Choong Yong · Puchong, MY

Key dates

Filing date	Nov 21, 2016
Grant date	Dec 11, 2018
Priority date	—
Expiry date	Jan 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10734
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a through-mold via package bottom interposer disposed on the package substrate on a land side. A land side board mates with the through-mold via package bottom interposer, and enough vertical space is created by the through-mold via package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.