Filling through-holes
US10154598B2 · kind B2 · utility
0Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2015 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1492
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.