Leon Barstad
13Patents
7h-index
29Co-inventors
62Inventor score
Filing activity: May 17, 1999 → Dec 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6444110B1 | Electrolytic copper plating method | Electricity | 39 | Expired |
| US6911068B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 17 | Expired |
| US6827839B2 | Plating bath analysis | Chemistry; Metallurgy | 17 | Expired |
| US6531046B2 | Seed layer repair method | Electricity | 17 | Expired |
| US6773573B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 16 | Expired |
| US6652731B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 14 | Expired |
| US6736954B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 11 | Expired |
| US7384535B2 | Bath analysis | Physics | 4 | Expired |
| US9598787B2 | Method of filling through-holes | Chemistry; Metallurgy | 3 | Active |
| US10508357B2 | Method of filling through-holes to reduce voids and other defects | Electricity | 1 | Active |
| US10154598B2 | Filling through-holes | Electricity | 0 | Active |
| US9365943B2 | Method of electroplating uniform copper layers | Electricity | 0 | Active |
| US10512174B2 | Method of filling through-holes to reduce voids and other defects | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.