Contact tip and contact element and method of producing the same
US10156588B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 9, 2015 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Feb 9, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A contact tip for a sequential test of electronic components comprises a base material and a hard material, wherein the base material and the hard material are fixed to each other and wherein the hard material has a thickness of at least 0.03 mm. The contact tip may be the contact tip of a contact element used for a sequential test of electronic components. A method of producing a contact tip of a contact element used for a sequential test of electronic components, comprises: Providing a plate made up of a base material and a hard material, wherein the base material and the hard material are fixed to each other; Cutting the plate along a cut line to form the contact tip wherein the cut line runs through the base material and the hard material and wherein the hard material has a thickness of at least 0.03 mm in a section where the cut line cuts the hard material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.