Patent · US Active

Contact tip and contact element and method of producing the same

US10156588B2 · kind B2 · utility

0Cited by
1References
7Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 9, 2015
Grant dateDec 18, 2018
Priority date
Expiry dateFeb 9, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/04
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A contact tip for a sequential test of electronic components comprises a base material and a hard material, wherein the base material and the hard material are fixed to each other and wherein the hard material has a thickness of at least 0.03 mm. The contact tip may be the contact tip of a contact element used for a sequential test of electronic components. A method of producing a contact tip of a contact element used for a sequential test of electronic components, comprises: Providing a plate made up of a base material and a hard material, wherein the base material and the hard material are fixed to each other; Cutting the plate along a cut line to form the contact tip wherein the cut line runs through the base material and the hard material and wherein the hard material has a thickness of at least 0.03 mm in a section where the cut line cuts the hard material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.