Method for determining the parameters of an IC manufacturing process by a differential procedure
US10156796B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2015 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method to easily determine parameters of a second process for manufacturing from parameters of a first process is provided. Metrics representative of differences between the first process and the second process are computed from a number of values of the parameters, which can be measured for the first process and the second process on a calibration layout, or which can be determined from pre-existing values for layouts or reference data for the first process and the second process by an interpolation/extrapolation procedure. A set of metrics are selected so that their combination gives a precise representation of the differences between the first process and the second process in all areas of a target design. Advantageously, the metrics are calculated as a product of convolution of the target design and a compound of a kernel function and a deformation function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.