Patent · US Active

Chip card module arrangement, chip card arrangement and method for producing a chip card arrangement

US10157848B2 · kind B2 · utility

1Cited by

0References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Pueschner · Kelheim, DE
Jens Pohl · San Luis Obispo, US
Thomas Spoettl · Mintraching, DE
Peter Stampka · Burglengenfeld, DE

Key dates

Filing date	Oct 14, 2015
Grant date	Dec 18, 2018
Priority date	—
Expiry date	Oct 14, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.