Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer
US10159142B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2016 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Jun 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.