Yuusuke HARUNA
9Patents
1h-index
12Co-inventors
40Inventor score
Filing activity: Jun 1, 2016 → Sep 16, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10638598B2 | Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board | Electricity | 1 | Active |
| US11597858B1 | Conductive adhesive | Electricity | 0 | Active |
| US12150239B2 | Method for manufacturing shielded printed wiring board and shielded printed wiring board | Electricity | 0 | Active |
| US11653439B2 | Ground member and shielded printed wiring board | Electricity | 0 | Active |
| US12101872B2 | Shield printed wiring board with ground member and ground member | Electricity | 0 | Active |
| US11457527B2 | Shield printed wiring board and method of manufacturing shield printed wiring board | Electricity | 0 | Active |
| US11758705B2 | Electromagnetic wave shielding film | Electricity | 0 | Active |
| US12028964B2 | Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member | Electricity | 0 | Active |
| US10159142B2 | Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.