Reinforced polyamide moulding compositions and injection mouldings produced therefrom
US10160860B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 9, 2015 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Oct 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2477/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A reinforced polyamide molding composition is described, particularly for use as starting material for the production of housings for devices in the field of mobile radio technology, composed of the following components:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.