Felix Koch
8Patents
2h-index
17Co-inventors
40Inventor score
Filing activity: Oct 9, 2015 → Dec 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10233326B2 | Polyamide moulding compound, moulded article produced herefrom and also purposes of use | Chemistry; Metallurgy | 9 | Active |
| US10392542B2 | Latent two-part polyurethane adhesives curable with infrared radiation | Chemistry; Metallurgy | 2 | Active |
| US11274236B2 | One-component toughened epoxy adhesives containing a mixture of latent curing agents | Chemistry; Metallurgy | 1 | Active |
| US11674063B2 | Epoxy resin adhesive compositions | Chemistry; Metallurgy | 0 | Active |
| US11820922B2 | Adhesive composition | Chemistry; Metallurgy | 0 | Active |
| US12092812B2 | Device for the two-dimensionally scanning beam deflection of a light beam | Physics | 0 | Active |
| US10160860B2 | Reinforced polyamide moulding compositions and injection mouldings produced therefrom | Chemistry; Metallurgy | 0 | Active |
| US10196518B2 | Polyamide moulding compound, moulded article produced herefrom and also purposes of use | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.