Method of test probe alignment control

US10161965B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Jui-Long Chen · Taichung, TW
• Chien-Chih Liao · Taichung, TW
• Chin-Hsiang Lin · Hsinchu, TW
• Hui-Yun Chao · Zhubei City, TW
• Jong-I Mou · Guoxing Township, TW
• Tseng Chin Lo · Hsinchu, TW
• Ta-Yung Lee · Hsinchu, TW

Key dates

• Filing date: Mar 16, 2015
• Grant date: Dec 25, 2018
• Expiry date: Mar 26, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A system and method for aligning a probe, such as a wafer-level test probe, with wafer contacts is disclosed. An exemplary method includes receiving a wafer containing a plurality of alignment contacts and a probe card containing a plurality of probe points at a wafer test system. A historical offset correction is received. Based on the historical offset correct, an orientation value for the probe card relative to the wafer is determined. The probe card is aligned to the wafer using the orientation value in an attempt to bring a first probe point into contact with a first alignment contact. The connectivity of the first probe point and the first alignment contact is evaluated. An electrical test of the wafer is performed utilizing the aligned probe card, and the historical offset correction is updated based on the orientation value.