Patent · US Active

System, apparatus, and method for embedding a 3D component with an interconnect structure

US10163687B2 · kind B2 · utility

2Cited by

27References

10Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

David Fraser Rae · San Diego, US
Lizabeth Keser · Chandler, US
Reynante Tamunan Alvarado · San Diego, US

Key dates

Filing date	Sep 22, 2015
Grant date	Dec 25, 2018
Priority date	—
Expiry date	Nov 5, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/37001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.