David Fraser Rae
13Patents
4h-index
17Co-inventors
49Inventor score
Filing activity: Mar 15, 2013 → Jul 9, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10410971B2 | Thermal and electromagnetic interference shielding for die embedded in package substrate | Electricity | 34 | Active |
| US9679873B2 | Low profile integrated circuit (IC) package comprising a plurality of dies | Electricity | 5 | Active |
| US9601472B2 | Package on package (POP) device comprising solder connections between integrated circuit device packages | Electricity | 5 | Active |
| US9484327B2 | Package-on-package structure with reduced height | Electricity | 4 | Active |
| US9985010B2 | System, apparatus, and method for embedding a device in a faceup workpiece | Electricity | 3 | Active |
| US9355898B2 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Electricity | 2 | Active |
| US10163687B2 | System, apparatus, and method for embedding a 3D component with an interconnect structure | Electricity | 2 | Active |
| US9601435B2 | Semiconductor package with embedded components and method of making the same | Electricity | 1 | Active |
| US11670599B2 | Package comprising passive device configured as electromagnetic interference shield | Electricity | 0 | Active |
| US9806048B2 | Planar fan-out wafer level packaging | Electricity | 0 | Active |
| US11393808B2 | Ultra-low profile stacked RDL semiconductor package | Electricity | 0 | Active |
| US11502049B2 | Package comprising multi-level vertically stacked redistribution portions | Electricity | 0 | Active |
| US11404343B2 | Package comprising a substrate configured as a heat spreader | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.