Lid design for heat dissipation enhancement of die package
US10163754B2 · kind B2 · utility
10Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2013 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Dec 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.