Yu-Chih Liu
61Patents
7h-index
102Co-inventors
75Inventor score
Filing activity: Jan 21, 2003 → Mar 31, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6793539B1 | Linking apparatus for stackable network devices | Electricity | 36 | Expired |
| US8150210B2 | Image synthesis system for a vehicle and the manufacturing method thereof | Physics | 12 | Active |
| US9735043B2 | Semiconductor packaging structure and process | Electricity | 11 | Active |
| US8916419B2 | Lid attach process and apparatus for fabrication of semiconductor packages | Electricity | 10 | Active |
| US10163754B2 | Lid design for heat dissipation enhancement of die package | Electricity | 10 | Active |
| US8288208B1 | Apparatus and methods for semiconductor packages with improved warpage | Electricity | 10 | Active |
| US9349663B2 | Package-on-package structure having polymer-based material for warpage control | Electricity | 8 | Active |
| US9673119B2 | System and method for bonding package lid | Electricity | 6 | Active |
| US9887144B2 | Ring structure for chip packaging | Electricity | 5 | Active |
| US9287233B2 | Adhesive pattern for advance package reliability improvement | Electricity | 5 | Active |
| US8593471B2 | Memory access method and access controller for a memory | Emerging Cross-Sectional Technologies | 5 | Active |
| US9786520B2 | Semiconductor device and manufacturing method thereof | Electricity | 4 | Active |
| US8652939B2 | Method and apparatus for die assembly | Electricity | 4 | Active |
| US6698559B1 | Hydraulic damping device | Mechanical Engineering; Lighting; Heating | 4 | Expired |
| US9627355B2 | Package-on-package structure having polymer-based material for warpage control | Electricity | 3 | Active |
| US9812410B2 | Lid structure for a semiconductor device package and method for forming the same | Electricity | 3 | Active |
| US9793242B2 | Packages with die stack including exposed molding underfill | Electricity | 2 | Active |
| US9142523B2 | Semiconductor device and manufacturing method thereof | Electricity | 2 | Active |
| US11417643B2 | Package-on-package with redistribution structure | Electricity | 2 | Active |
| US9805997B2 | Packaging methods for semiconductor devices with encapsulant ring | Electricity | 2 | Active |
| US11665531B2 | End to end troubleshooting of mobility services | Electricity | 1 | Active |
| US10921660B2 | Circuit board, display panel and display device | Electricity | 1 | Active |
| US9893043B2 | Method of manufacturing a chip package | Electricity | 1 | Active |
| US10825807B2 | Electrostatic protection circuit, array substrate, display panel and display device | Electricity | 1 | Active |
| US10157772B2 | Semiconductor packaging structure and process | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.