Integrated circuit package with multi-die communication
US10163763B1 · kind B1 · utility
1Cited by
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27Claims
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Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jun 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package having a first die configured to sense a first physical characteristic and provide a first data signal, and a second die, wherein the first die is configured to transmit the first data signal to the second die, and the second die is configured to determine if there is an error in the first die and transmit the result to a controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.