Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
US10163798B1 · kind B1 · utility
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Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.