Inventor · Phoenix, AZ, US

Robert L. Sankman

152Patents
13h-index
183Co-inventors
89Inventor score

Filing activity: Jun 28, 2000 → Mar 21, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US6388207B1 Electronic assembly with trench structures and methods of manufacture Electricity 141 Expired
US9349703B2 Method for making high density substrate interconnect using inkjet printing Electricity 86 Active
US10163798B1 Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same Electricity 71 Active
US8987918B2 Interconnect structures with polymer core Electricity 48 Active
US9224674B2 Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages Electricity 35 Active
US6664483B2 Electronic package with high density interconnect and associated methods Electricity 34 Expired
US8535989B2 Embedded semiconductive chips in reconstituted wafers, and systems containing same Electricity 33 Active
US9741664B2 High density substrate interconnect formed through inkjet printing Electricity 27 Active
US8207453B2 Glass core substrate for integrated circuit devices and methods of making the same Emerging Cross-Sectional Technologies 20 Active
US7268425B2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method Emerging Cross-Sectional Technologies 19 Expired
US7212405B2 Method and apparatus for providing distributed fluid flows in a thermal management arrangement Electricity 14 Expired
US6555920B2 Vertical electronic circuit package Electricity 14 Expired
US6493223B1 Computer utilizing refrigeration for cooling Physics 13 Expired
US9543224B1 Hybrid exposure for semiconductor devices Electricity 11 Active
US6900991B2 Electronic assembly with sandwiched capacitors and methods of manufacture Electricity 11 Expired
US7456047B2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method Emerging Cross-Sectional Technologies 9 Active
US8278214B2 Through mold via polymer block package Electricity 9 Active
US7133294B2 Integrated circuit packages with sandwiched capacitors Electricity 8 Expired
US6680218B2 Fabrication method for vertical electronic circuit package and system Electricity 7 Expired
US8969140B2 Embedded semiconductive chips in reconstituted wafers, and systems containing same Electricity 7 Active
US6717277B2 Electrical assembly with vertical multiple layer structure Electricity 7 Expired
US6563210B2 Parallel plane substrate Electricity 6 Expired
US8963135B2 Integrated circuits and systems and methods for producing the same Performing Operations; Transporting 6 Active
US9368437B2 High density package interconnects Electricity 6 Active
US7046528B2 Load-dependent variable frequency voltage regulator Electricity 6 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.