Integrated fan-out packages and methods of forming the same
US10163803B1 · kind B1 · utility
36Cited by
10References
20Claims
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Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a first die, at least one through integrated fan-out via and a molding layer. The at least one through integrated fan-out via is aside the first die and includes a seed layer and a metal layer. The molding layer encapsulates the at least one through integrated fan-out via and the first die. Besides, the seed layer surrounds a sidewall of the metal layer and is between the metal layer and the molding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.