Method for producing semiconductor package
US10163847B2 · kind B2 · utility
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3References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Mar 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a semiconductor package is a method for producing a semiconductor package in which a plurality of semiconductor chips, each of which includes a substrate, conductive portions formed on the substrate, and microbumps formed on the conductive portions, are laminated, which includes a heating process of causing a reducing gas to flow in an inert atmosphere into a space where the semiconductor chips are arranged and heated at or higher than a temperature of a melting point of the microbump, and in the heating process, a pressure application member is mounted on the microbump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.