Inventor · Tokyo, JP

Yuhei Horikawa

27Patents
3h-index
15Co-inventors
56Inventor score

Filing activity: Jul 22, 2011 → May 7, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9818736B1 Method for producing semiconductor package Electricity 8 Active
US9257402B2 Terminal structure, and semiconductor element and module substrate comprising the same Electricity 3 Active
US8933336B2 Coating and electronic component Electricity 3 Active
US8692127B2 Terminal structure, printed wiring board, module substrate, and electronic device Electricity 3 Active
US10374301B2 Wiring component Electricity 2 Active
US9640500B2 Terminal structure and semiconductor device Electricity 2 Active
US11031330B2 Electroconductive substrate, electronic device and display device Electricity 1 Active
US8976076B2 High-frequency transmission line, antenna, and electronic circuit board Electricity 1 Active
US9070606B2 Terminal structure and semiconductor device Electricity 1 Active
US10867898B2 Electroconductive substrate, electronic device and display device Electricity 1 Active
US8787028B2 Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure Emerging Cross-Sectional Technologies 0 Active
US10354973B2 Method for producing semiconductor chip Electricity 0 Active
US10205250B2 Junction structure for an electronic device and electronic device Electricity 0 Active
US11869834B2 Electroconductive substrate, electronic device and display device Electricity 0 Active
US10304779B2 Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof Electricity 0 Active
US10392704B2 Coating electronic component Electricity 0 Active
US10354796B2 Method for manufacturing planar coil Electricity 0 Active
US11668008B2 Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor Electricity 0 Active
US8970037B2 Terminal structure, and semiconductor element and module substrate comprising the same Electricity 0 Active
US11466368B2 Sheet material, metal mesh and manufacturing methods thereof Electricity 0 Active
US9177687B2 Coating and electronic component Emerging Cross-Sectional Technologies 0 Active
US9224706B2 Terminal structure, and semiconductor element and module substrate comprising the same General 0 Revoked
US11410855B2 Method of producing electroconductive substrate, electronic device and display device Emerging Cross-Sectional Technologies 0 Active
US10163847B2 Method for producing semiconductor package Electricity 0 Active
US8816213B2 Terminal structure, printed wiring board, module substrate, and electronic device Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.