Patent · US Active

Switching layer scheme to enhance RRAM performance

US10164182B1 · kind B1 · utility

18Cited by
4References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 26, 2017
Grant dateDec 25, 2018
Priority date
Expiry dateJul 15, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10N70/883
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to an RRAM device. In some embodiments, the RRAM device includes a lower electrode disposed over a conductive lower interconnect layer. An upper electrode is over the lower electrode and a multi-layer data storage structure is between the lower and upper electrodes. The multi-layer data storage structure has first and second sub-layers. The first sub-layer has a first metal from a first group of metals, a first concentration of a second metal from a second group of metals, and oxygen. The second sub-layer has a third metal from the first group of metals, a non-zero second concentration of a fourth metal from a second group of metals, and oxygen. The non-zero second concentration is smaller than the first concentration and causes conductive filaments formed within the second sub-layer to be wider than conductive filaments formed within the first sub-layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.