Stress isolation platform for MEMS devices
US10167189B2 · kind B2 · utility
16Cited by
110References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.