Patent · US Active

Method of operating semiconductor manufacturing apparatus and semiconductor devices

US10170285B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. · CN

Inventors

Jinrong Zhao · Beijing, CN
Shaohua Liu · Huizhou, CN
Gang Wei · Beijing, CN
Yulin PENG · Beijing, CN
Meng Yang · Beijing, CN
Yali Fu · Beijing, CN

Key dates

Filing date	Jan 10, 2018
Grant date	Jan 1, 2019
Priority date	—
Expiry date	Jan 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10D30/62
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wall. The bottom side includes gas passages for plasma particles to pass through the liner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.