Release film as isolation film in package
US10170341B1 · kind B1 · utility
27Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Nov 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.