Manufacturing method of package carrier
US10177067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2017 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | May 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method including following steps is provided. A substrate that includes a core layer, a first conductive layer, and a second conductive layer is provided. A heat conducting channel is formed in the substrate, and an adhesion layer is formed on the second conductive layer to cover a side of the heat conducting channel. A heat conducting element and a buffer layer are placed into the heat conducting channel, and a gap is formed between either the heat conducting element or the buffer layer and an inner side surface of the heat conducting channel. The gap is filled with a first insulant material, and the adhesion layer and the buffer layer are removed to form a cavity and expose the heat conducting element. The first conductive layer and the second conductive layer are patterned to form a first patterned circuit layer and a second patterned circuit layer, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.