Patent assignee · TW · COMPANY

Subtron Technology Co., Ltd.

73Patents
70Active
73Granted
51Portfolio score

Filing activity: Aug 18, 1999 → Jan 20, 2021 · 5 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7223687B1 Printed wiring board and method of fabricating the same Emerging Cross-Sectional Technologies 16 Active
US8441121B2 Package carrier and manufacturing method thereof Electricity 5 Active
US8859908B2 Package carrier Electricity 5 Active
US6232551A Substrate board for semiconductor package Electricity 5 Expired
US6353997B1 Layer build-up method for manufacturing multi-layer board Emerging Cross-Sectional Technologies 4 Expired
US8624388B2 Package carrier and manufacturing method thereof Electricity 3 Active
US8390013B2 Semiconductor package structure and fabricating method of semiconductor package structure Electricity 3 Active
US8510936B2 Manufacturing method of package carrier Emerging Cross-Sectional Technologies 3 Active
US7540969B2 High thermal conducting circuit substrate and manufacturing process thereof Electricity 2 Active
US7838338B2 Fabricating process of thermal enhanced substrate Emerging Cross-Sectional Technologies 2 Active
US8415780B2 Package carrier and manufacturing method thereof Emerging Cross-Sectional Technologies 2 Active
US8973258B2 Manufacturing method of substrate structure Emerging Cross-Sectional Technologies 2 Active
US7786501B2 Fabricating process and structure of thermal enhanced substrate Emerging Cross-Sectional Technologies 2 Active
US9137899B2 Process of electronic structure and electronic structure Emerging Cross-Sectional Technologies 2 Active
US9591753B2 Circuit board and manufacturing method thereof Electricity 2 Active
US8704101B2 Package carrier and manufacturing method thereof Emerging Cross-Sectional Technologies 2 Active
US8737081B2 Cover structure and manufacturing method thereof Emerging Cross-Sectional Technologies 1 Active
US8803295B2 Circuit structure and manufacturing method thereof Electricity 1 Active
US9668351B2 Package carrier and manufacturing method thereof Electricity 1 Active
US10297517B2 Manufacturing method of package carrier Electricity 1 Active
US8513530B2 Package carrier and manufacturing method thereof Emerging Cross-Sectional Technologies 1 Active
US9418931B2 Package structure and manufacturing method thereof Electricity 1 Active
US7441329B2 Fabrication process circuit board with embedded passive component Emerging Cross-Sectional Technologies 1 Expired
US9578750B2 Package carrier and manufacturing method thereof Electricity 1 Active
US10177067B2 Manufacturing method of package carrier Electricity 1 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.