Analog capacitor on submicron pitch metal level
US10177215B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2017 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Oct 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/66
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device includes a capacitor having a lower plate of interconnect metal, a capacitor dielectric layer with a lower silicon dioxide layer, a silicon oxy-nitride layer, and an upper silicon dioxide layer, and an upper plate over the capacitor dielectric layer. The silicon oxy-nitride layer has an average index of refraction of 1.85 to 1.95 at a wavelength of 248 nanometers. To form the microelectronic device, the lower silicon dioxide layer, the silicon oxy-nitride layer, and the upper silicon dioxide layer are formed in sequence over an interconnect metal layer. The upper plate is formed, leaving the lower silicon dioxide layer, the silicon oxy-nitride layer, and at least a portion of the upper silicon dioxide layer over the interconnect metal layer. An interconnect mask is formed of photoresist over the upper plate and the silicon oxy-nitride layer, using the silicon oxy-nitride layer as an anti-reflection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.