Patent · US Active

Soldered components for downhole use

US10180035B2 · kind B2 · utility

0Cited by

6References

30Claims

0Family size

Assignees

SCHLUMBERGER TECHNOLOGY CORPORATION · US
UNIVERSITY OF MARYLAND, COLLEGE PARK · US

Inventors

Chandradip Pravinbhai Patel · Missouri City, US
Mark Kostinovsky · Houston, US
Francis Dupouy · Stonehouse, GB
Glen Dell Schilling · Richmond, US
Gilles Iafrate · Chaponost, FR
F. Patrick McCluskey · Ellicott City, US

Key dates

Filing date	Mar 12, 2015
Grant date	Jan 15, 2019
Priority date	—
Expiry date	Apr 5, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K35/262
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.