Mark Kostinovsky
6Patents
0h-index
8Co-inventors
30Inventor score
Filing activity: Dec 12, 2014 → Aug 11, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10180035B2 | Soldered components for downhole use | Performing Operations; Transporting | 0 | Active |
| US12226822B2 | Additive manufacturing process of 3D electronic substrate | Electricity | 0 | Active |
| US11765839B2 | Additive manufactured 3D electronic substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US11329023B2 | Interconnection of copper surfaces using copper sintering material | Emerging Cross-Sectional Technologies | 0 | Active |
| US11676926B2 | Solder joints on nickel surface finishes without gold plating | Emerging Cross-Sectional Technologies | 0 | Active |
| US10376995B2 | Tin-antimony-based high temperature solder for downhole components | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.