Patent · US Active

Method and device for the contactless assessment of the surface quality of a wafer

US10180316B2 · kind B2 · utility

3Cited by

0References

15Claims

0Family size

Assignee

Brodmann Technologies GmbH · DE

Inventors

Rainer Brodmann · Haar, DE
Boris Brodmann · Karlsruhe, DE

Key dates

Filing date	Aug 25, 2016
Grant date	Jan 15, 2019
Priority date	—
Expiry date	Aug 25, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG01N2021/4723
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method and a device for contactless assessment of the surface quality of a workpiece (W) according to the angle-resolved scattered light measuring technique comprises an optical sensor (10) which illuminates a measuring spot (14). The intensity of the radiation which is reflected back is detected by means of a line sensor (16), and an intensity characteristic value (Ig) is determined therefrom. A horizontal initial rotation angle (θ) at which the intensity characteristic value is at a maximum is determined. In a measuring operating mode, surface characteristic values are calculated taking into account this initial rotational angle (θ). The measuring method is defined by extremely high lateral and vertical spatial resolution, extending into the subnanometer range, and by a high measuring speed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.