Patent · US Active

Chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package

US10180468B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Rainer Markus Schaller · Kelheim, DE
Goran Keser · Munich, DE
Manuel Harrant · Taufkirchen, DE

Key dates

Filing date	Jun 8, 2016
Grant date	Jan 15, 2019
Priority date	—
Expiry date	Aug 30, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10N52/80
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package including: a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.