Method for manufacturing a wafer of semiconducting material based on a group 13 element nitride
US10181399B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jul 27, 2015 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Jul 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semi-conducting material including a layer of nitride of a group 13 element comprising active areas for manufacturing electronic components, and inactive areas, the active and inactive areas extending on a front face of the layer of nitride, the method comprising steps consisting of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.