Lead frame and method of manufacturing the same
US10181436B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2017 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05664
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes leads including inner leads and outer leads. Each of the leads includes an inner lead and an outer lead. A tie bar extends so as to cross connecting points of the inner leads and the outer leads. The leads and the tie bar include a first surface, a second surface, and side surfaces. A plating layer is provided on the inner leads, the outer leads and the tie bar. A first non-plating region is provided between an edge in the first surface of the inner lead and an edge of the plating layer provided on the first surface of the inner lead. A second non-plating region is provided between an edge of the first surface on the inner lead side of the tie bar and an edge on the inner lead side of the plating layer provided on the first surface of the tie bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.