SH MATERIALS CO., LTD.
7Patents
7Active
7Granted
43Portfolio score
Filing activity: Jul 26, 2013 → Dec 20, 2017
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9735096B1 | Lead frame and method for manufacturing the same | Electricity | 2 | Active |
| US9691689B2 | Lead frame for mounting semiconductor element and method for manufacturing the same | Electricity | 2 | Active |
| US9583422B2 | Lead frame | Electricity | 0 | Active |
| US9735106B2 | Semiconductor lead frame, semiconductor package, and manufacturing method thereof | Electricity | 0 | Active |
| US10181436B2 | Lead frame and method of manufacturing the same | Electricity | 0 | Active |
| US9870930B2 | Method for producing substrate for mounting semiconductor element | Electricity | 0 | Active |
| US9054116B2 | Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.